연구활동 Research activities

논문
  • [국외]
  • Surface reaction during thermal atomic layer etching of aluminum oxide films using fluorine radicals and trimethylaluminum, Applied Surface Science 641 (2023)
  • A theoretical study on the surface reaction of tetrakis(dimethylamino)titanium on titanium oxide, PHYSICAL CHEMISTRY CHEMICAL PHYSICS 25 (2023)
  • Gas-phase etching mechanism of silicon oxide by a mixture of hydrogen fluoride and ammonium fluoride: A density functional theory study, Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 41 (2023)
  • Surface Reaction Mechanism of Atomic Layer Deposition of Niobium Oxide: In situ Characterization and First-principle Study, Applied Surface Science 615 (2023)
  • Selective etching mechanism of silicon oxide against silicon by hydrogen fluoride: a density functional theory study, Physical Chemistry Chemical Physics 25 (2023)
  • Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations, JOURNAL OF ELECTRONIC PACKAGING 144 (2022)
  • Atomic layer deposition of silicon oxide films using bis(dimethylaminomethylsilyl)trimethylsilylamine and ozone: first-principles and experimental study, JOURNAL OF MATERIALS CHEMISTRY C 10 (2022)
  • Composition control of conformal crystalline GeSbTe films by atomic layer deposition supercycles and tellurization annealing, JOURNAL OF MATERIALS CHEMISTRY C 10 (2022)
  • Atomic layer deposition of titanium oxide thin films using a titanium precursor with a linked amido-cyclopentadienyl ligand, Journal of Materials Chemistry C 10 (2022)
  • Density functional theory study on the selective capping of cobalt on copper interconnect, Applied Surface Science 585 (2022)
  • Finite Element Analysis for Safe Design of a Flexible Microelectronic System under Bending Deformation, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 11 (2022)
  • Preparation of tungsten-based thin films using a F-free W precursor and tert-butyl hydrazine via 2- and 3-step atomic layer deposition process, Applied Surface Science 578 (2022)
  • Effect of deposition temperature and surface reactions in atomic layer deposition of silicon oxide using Bis(diethylamino)silane and ozone, Applied Surface Science 571 (2022)
  • Atomic layer deposition of tungsten and tungsten-based compounds using WCl5 and various reactants selected by density functional theory, Applied Surface Science 563 (2021)
  • Density functional theory study on the modification of silicon nitride surface by fluorine-containing molecules, Applied Surface Science 554 (2021)
  • Process steps for high quality si-based epitaxial growth at low temperature via rpcvd, Materials 14 (2021)
  • Surface reaction of the hafnium precursor with a linked amido-cyclopentadienyl ligand: A density functional theory study, Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 39 (2021)
  • Density functional theory study on the reducing agents for atomic layer deposition of tungsten using tungsten chloride precursor, Applied Surface Science 538 (2021)
  • Reactivity of different nitriding agents with chlorine-terminated surface during atomic layer deposition of silicon nitride, Applied Surface Science 535 (2021)
  • Mechanical analysis of a flexible microelectronic system under twisting stress, Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics 38 (2020)
  • Si‐core/SiGe‐shell channel nanowire FET for sub‐10‐nm logic technology in the THz regime, Etri Journal 41 (2019)
  • Atomic layer deposition and tellurization of Ge–Sb film for phase-change memory applications, Rsc Advances 9 (2019)
  • Preparation of Ge-Sb-Te Thin Films by Tellurization of Ge-Sb Thin Film for Phase-Change Random-Access Memory Application, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 8 (2019)
  • Density functional theory study on the fluorination reactions of silicon and silicon dioxide surfaces using different fluorine-containing molecules, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A 37 (2019)
  • Catalyzed Atomic Layer Deposition of Silicon Oxide at Ultralow Temperature Using Alkylamine, LANGMUIR 34 (2018)
  • Ultrathin SiGe Shell Channel p-Type FinFET on Bulk Si for Sub-10-nm Technology Nodes, Ieee Transactions On Electron Devices 65 (2018)
  • Novel Cyclosilazane-Type Silicon Precursor and Two-Step Plasma for Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride, Acs Applied Materials & Interfaces 10 (2018)
  • Surface reaction of silicon chlorides during atomic layer deposition of silicon nitride, Applied Surface Science 432 (2018)
  • Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene) nickel, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A 36 (2018)
  • Study of surface reaction during selective epitaxy growth of silicon by thermodynamic analysis and density functional theory calculation, Journal Of Crystal Growth 468 (2017)
  • Reaction Mechanism for Atomic Layer Deposition of Germanium Ditelluride Thin Films, Journal Of Nanoscience And Nanotechnology 17 (2017)
  • Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via, Journal Of Electronic Packaging 138 (2016)
  • Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor, Acs Applied Materials & Interfaces 8 (2016)
  • Reactivity of different surface sites with silicon chlorides during atomic layer deposition of silicon nitride, Rsc Advances 6 (2016)
  • Selective growth of graphene in layer-by-layer via chemical vapor deposition, Nanoscale 8 (2016)
  • Reaction Mechanism Underlying Atomic Layer Deposition of Antimony Telluride Thin Films, Journal Of Nanoscience And Nanotechnology 16 (2016)
  • Atomic layer deposition of stoichiometric Co3O4 films using bis(1,4-di-iso-propyl-1,4-diazabutadiene) cobalt, Thin Solid Films 589 (2015)
  • Graphene film growth on sputtered thin Cu-Ni alloy film by inductively coupled plasma chemical vapor deposition, RSC ADVANCES 4 (2014)
  • Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition, THIN SOLID FILMS 556 (2014)
  • Failure mechanism of copper through-silicon vias under biased thermal stress, THIN SOLID FILMS 546 (2013)
  • Atomic layer deposition of cobalt oxide thin films using cyclopentadienylcobalt dicarbonyl and ozone at low temperatures, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 31 (2013)
  • Atomic Layer Deposition of SiO2 Thin Films Using Tetrakis(ethylamino)silane and Ozone , Journal Of Nanoscience And Nanotechnology 12 (2012)
  • The electrical properties of dielectric stacks of SiO2 and Al2O3 prepared by atomic layer deposition method, CURRENT APPLIED PHYSICS 12 (2012)
  • Influence of the deposition temperature on the properties of copper thin films prepared by alternating injection of Cu(ethylketoiminate)(2) and H-2 on a ruthenium substrate, MICROELECTRONIC ENGINEERING 89 (2012)
  • Low-Temperature Atomic Layer Deposition of Cobalt Oxide Thin Films Using Dicobalt Hexacarbonyl tert-Butylacetylene and Ozone, ELECTROCHEMICAL AND SOLID STATE LETTERS 15 (2012)
  • RF transmission properties of graphene monolayers with width variation, PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS 6 (2012)
  • Characteristics of SiO(2)/Si(3)N(4)/SiO(2) Stacked-Gate Dielectrics Obtained via Atomic-Layer Deposition , Journal of Nanoscience and Nanotechnology 11-7(SI) (2011)
  • Graphene synthesis on Fe foil using thermal CVD, Current Applied Physics 11-4 (2011)
  • The effect of Mg concentration and annealing temperature on the adhesion characteristics of Cu(Mg) films on glass substrates, Surface & Coatings Technology 205(2010) (2010)
  • Study of Si3N4/SiO2/Si and SiO2/Si3N4/Si Multilayers by O and N K-Edge X-ray Absorption Spectroscopy, Japanese Journal of Applied Physics 49-8 (2010)
  • Atomic Layer Deposition and Properties of Silicon Oxide Thin Films Using Alternating Exposures to SiH2Cl2 and O3, Japanese Journal of Applied Physics 49-7 (2010)
  • Growth studies and characterization of silicon nitride thin films deposited by alternating exposures to Si2Cl6 and NH3, Thin Solid Films 517-14 (2009)
  • Characteristics of silicon oxide thin films prepared by sol electrophoretic deposition method using tetraethylorthosilicate as the precursor, Current Applied Physics 9-2 (2009)
  • Sensing behavior and mechanism of mixed potential NOx sensors using NiO, NiO(+YSZ) and CuO oxide electrodes, Sensors and Actuators B : Chemical 135-2 (2009)
  • Characteristics of Silicon Dioxide Film Deposited by Neutral Beam-Assisted Chemical Vapor Deposition, Japanese Journal of Applied Physics 47-12 (2008)
  • Atomic layer deposition of silicon oxide thin films by alternating exposures to Si2Cl6 and O-3, ELECTROCHEMICAL AND SOLID STATE LETTERS 11-7 (2008)
  • Study of Implanted B+ and P+ Ions into Si (100) for Ultra Shallow Junction by SIMS, Journal of Surface Analysis 14-4 (2008)
  • Influence of Hydrothermal Processing Parameters on Phase Stability of Hydroxyapatite, Key Engineering Materials 342-343 (2007)
  • Effects of Thin Hydroxyapatite Coating on Initial Response of Osteoblast-Like Cells, Key Engineering Materials 342-343 (2007)
  • Sinterbility and Mechanical Properties of Zirconia Nanoparticles Prepared by Hydrothermal Process, Solid State Phenomena 124-126 (2007)
  • Characteristics of SiO2 Film Grown by Atomic Layer Deposition as the Gate Insulator of Low-Temperature Polysilicon Thin-Film Transistors, Solid State Phenomena 124-126 (2007)
  • Histomorphometric Analysis of Zirconia/Alumina Composite and CP Titanium Treaded Implants in Rabbit Tibia, Key Engineering Materials 309-311 (2006)
  • Polyimide surface modification by low energy ion beam irradiation, Materials Science Forum 492~493 (2005)

  •  
  • [국내]
  • SiGe Heterojunction FinFET Towards Tera-Hertz Applications, Journal of the Korean Physical Society 72 (2018)
  • 굽힘응력을 받는 유연전자소자에서 중립축 위치의 제어, 마이크로전자 및 패키징학회지 23 (2016)
  • Effects of hydrogen in the cooling step of chemical vapor deposition of graphene, ELECTRONIC MATERIALS LETTERS 9 (2013)
  • Low damage-transfer of graphene using epoxy bonding, ELECTRONIC MATERIALS LETTERS 9 (2013)
  • Pulsed Inductively-Coupled Plasma Doping of Phosphorus for N+-P Junction Fabrication, Journal of the Korean Physical Society 54-5 (2009)
  • Influence of Deposition Temperature and Substrate Orientation on the Microstructure of Pr0.7Ca0.3MnO3 Films Grown on Platinum Substrates by Using Pulsed Laser Deposition, Journal of the Korean Physical Society 54-1 (2009)
  • Behavior of boron implanted into n-Si (100) by low-energy (<= 2 keV) ion implantation for a shallow junction, Journal of the Korean Physical Society 52-4 (2008)
  • 펄스 레이저 증착법으로 제조된 인산칼슘 박막의 Ca-free Hanks' Balanced Salt Solution 내에서의 용해도, Biomaterials Research 11-2 (2007)
  • Remaining Oxide and Low-Energy Ion Implantation of BF2+ for Si (100), J. Korean Phys. Soc. 50-3 (2007)
  • Influence of Substrate Temperature on the Growth Rate and the Composition of Calcium Phosphate Films Prepared by Using Pulsed Laser Deposition, J. Korean Phys. Soc. 49-6 (2006)
  • Influences of Ambient gases on the Structure and the Composition of Calcium Phosphate Films Prepared by Pulsed Laser Deposition, J. Korean Phys. Soc. 49-5 (2006)
  • Characteristics of Silicon Nitride Thin Films Prepared Using Alternating Exposures of SiH2Cl2 and NH3, Journal of Korean Physical Society 47-3 (2005)
  • 지르코니아 복합 세라믹의 표면거칠기에 따른 조골세포의 반응, 대한구강악안면임플란트학회지 9-1 (2005)
  • Characteristics of Calcium Phosphate Films Prepared by Pulsed Laser Deposition under Various Water Vapor Pressures, Journal of Korean Physical Society 47-1 (2005)
특허
  • [국외]
  • GeSbTe 막을 형성하는 방법, 2023-01 (출원)
  • Chuck Pin, Method for Manufacturing a Chuck Pin, Apparatus for Treating a Substrate, 2019-08 (출원)
  • 척핀, 척핀 제조 방법 및 기판 처리 장치, 2016-11 (출원)
  • 척핀, 척핀 제조 방법 및 기판 처리 장치, 2016-11 (출원)

  •  
  • [국내]
  • ALD 공정에서 금속 전구체 환원용 환원제 조성물 및 금속 박막의 형성 방법, 2023-10 (등록)
  • 도즈량에 따른 선택적 원자층 식각 방법, 2023-08 (출원)
  • 자기조립단분자막을 이용한 원자층 식각 방법, 2023-02 (출원)
  • 텅스텐 전구체, 이를 이용한 텅스텐 박막 증착 방법 및 장치, 2022-12 (출원)
  • 전구체 공급에 적합한 구조를 갖는 사이클론 기화기, 2022-10 (출원)
  • 멀티 히팅 영역을 구비한 사이클론 기화기, 2022-10 (출원)
  • ALD 공정에서 금속 전구체 환원용 환원제 조성물 및 금속 박막의 형성 방법, 2022-09 (출원)
  • GeSbTe 막을 형성하는 방법, 2022-01 (출원)
  • 평탄화 장치 및 이를 포함하는 기판 처리 장치, 기판 처리 방법, 2021-06 (등록)
  • 원자층 증착법을 이용한 Ti-Te 막 증착 방법, 및 Ti-Te 분리막을 포함하는 다층 상변화 구조체 및 상변화 메모리 소자, 2021-05 (등록)
  • 텅스텐 전구체, 이를 이용한 텅스텐 박막 증착 방법 및 증착 장치, 2020-11 (출원)
  • ALD 공정에서 금속 전구체 환원용 환원제 조성물 및 금속 박막의 형성 방법, 2020-02 (출원)
  • 평탄화 장치 및 이를 포함하는 기판 처리 장치, 기판 처리 방법, 2019-11 (출원)
  • 실리콘 질화막의 증착 방법 및 상기 실리콘 질화막의 증착 장치, 2019-04 (등록)
  • 원자층 증착을 이용한 칼코겐-함유 막의 제조 방법, 2019-02 (등록)
  • 실리콘 질화막의 증착 방법 및 상기 실리콘 질화막의 증착 장치, 2019-02 (출원)
  • ALD 공정에서 금속 전구체 환원용 환원제 조성물 및금속 박막의 형성 방법, 2019-02 (출원)
  • 다층 상변화 물질막 및 이의 제조 방법,이를 포함하는 상변화 메모리 소자, 2018-12 (등록)
  • 칼코겐-함유 막 및 이의 제조 방법, 2018-04 (등록)
  • 원자층 증착법을 이용한 Ti-Te 막 증착 방법, 및 Ti-Te 분리막을 포함하는 다층 상변화 구조체 및 상변화 메모리 소자, 2018-02 (출원)
  • 실리콘 질화막의 증착 방법 및 상기 실리콘 질화막의 증착 장치, 2017-05 (출원)
  • 다층 상변화 물질막 및 이의 제조 방법,이를 포함하는 상변화 메모리 소자, 2017-05 (출원)
  • 반도체 다이의 형상 변화를 이용하여 응력을 감소시킨 유연전자소자 및 그 제조방법, 2017-05 (출원)
  • 코발트-함유 박막의 제조 방법, 2016-06 (출원)
  • 중립축 위치가 조절된 유연전자소자 및 그 제조방법, 2016-05 (출원)
  • 실리콘 질화막의 증착 방법 및 상기 실리콘 질화막의 증착 장치, 2016-04 (출원)
  • 원자층 증착을 이용한 칼코겐-함유 막의 제조 방법, 2016-04 (출원)
  • 척핀, 척핀 제조 방법 및 기판 처리 장치, 2016-01 (등록)
  • 척핀, 척핀 제조 방법 및 기판 처리 장치, 2016-01 (출원)
  • 실리콘 관통전극 구조체 및 이의 열-기계적 응력 예측 방법, 2015-12 (등록)
  • 척핀, 척핀 제조 방법 및 기판 처리 장치, 2015-11 (출원)
  • 불소코팅물품, 불소코팅물품 제조 방법 및 기판 처리 장치, 2015-11 (출원)
  • 칼코겐-함유 막 및 이의 제조 방법, 2015-11 (출원)
  • 산화금속 박막의 제조 방법 및 상기 박막을 이용하는 리튬이차전지, 2015-01 (출원)
  • 실리콘 관통전극 구조체 및 이의 열-기계적 응력 예측 방법, 2014-10 (출원)
  • 칼코겐-함유 막 및 이의 제조 방법, 2014-06 (출원)
  • 서로 다른 젖음성을 갖는 영역들을 구비하는 캐리어 기판, 이를 사용한 소자 기판 처리 방법, 2014-04 (등록)
  • 박막 전지용 리튬-함유 박막 형성용 타겟 및 이의 제조 방법, 2014-04 (등록)
  • 전기도금용 구리 금속 박막 및 그의 제조 방법, 및 이를 이용한 반도체 소자의 구리 배선 형성 방법, 2013-12 (출원)
  • 박막 증착 장치 및 방법, 2013-12 (등록)
  • 구리 이온 드리프트의 측정을 위한 구조체 및 이를 이용한 구리 이온 드리프트의 측정 방법, 2013-01 (등록)
  • 서로 다른 젖음성을 갖는 영역들을 구비하는 캐리어 기판, 이를 사용한 소자 기판 처리 방법, 2012-08 (출원)
  • 박막 증착 장치 및 방법, 2012-05 (출원)
  • 금속-공기 전지,그의제조방법,및 상기 금속-공기 전지를 포함하는 전지 모듈, 2011-08 (출원)
  • 박막 측정 방법 및 박막 측정 장치, 2011-05 (등록)
  • 구리 이온 드리프트의 측정을 위한 구조체 및 이를 이용한 구리 이온 드리프트의 측정 방법, 2011-03 (출원)
  • 그래핀 배선 형성 방법, 2011-03 (출원)
  • 박막 전지용 리튬-함유 박막 형성용 타겟 및 이의 제조 방법, 2011-02 (출원)
  • 원자층 증착법에 의한 금속 박막 증착 방법, 2011-02 (등록)
  • 박막 측정 방법 및 박막 측정 장치, 2008-10 (출원)
  • 원자층 증착법에 의한 금속 박막 증착 방법, 2008-08 (출원)
  • 다층 절연박막, 2007-09 (등록)
  • 다층 절연박막의 구조, 2006-08 (출원)
학술발표
  • Atomic Layer Deposition of Silicon Oxide Films Using tris(dimethylamino)silane and Ozone, KISM2023(한국반도체디스플레이기술학회), 2023-11
  • Etching Mechanism of Amorphous Hydrogenated Silicon Nitride by Hydrogen Fluoride, KISM2023(한국반도체디스플레이기술학회), 2023-11
  • Thermal Atomic Layer Deposition of Silicon Carbonitride: A Density Functional Theory , 244th ECS Meeting(THE ELECTROCHEMICAL), 2023-10
  • Effect of Cu Pad Geometry and Dishing in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study, 244th ECS Meeting(THE ELECTROCHEMICAL), 2023-10
  • Atomic Layer Etching of Al2O3 Using F Radical and Al Precursors: Surface Reaction and Reaction Mechanism Study, 244th ECS Meeting(THE ELECTROCHEMICAL　), 2023-10
  • Thermal Atomic Layer Deposition of Gallium Nitride Films Using Tris(dimethylamido)gallium and Ammonia, 244th ECS Meeting(THE ELECTROCHEMICAL　), 2023-10
  • Finite Element Analysis of the Cu Pad Array Design of Hybrid Bonding, ISMP2023(한국마이크로일렉트로닉스 및 패키징학회), 2023-10
  • Temperature Dependence of Al₂O₃ Atomic Layer Etching Using NF₃ Remote Plasma and Trimethylaluminum, 한국진공학회 제65회 하계정기학술대회 & IFFM 2023(한국진공학회 (Korean Vacuum Society)), 2023-08
  • High-Temperature Atomic Layer Deposition of Silicon Oxide Films Using tris(dimethylamino)silane and Ozone, 한국진공학회 제65회 하계정기학술대회 & IFFM 2023(한국진공학회 (Korean Vacuum Society)), 2023-08
  • Atomic Layer Deposition of Niobium Oxide UsingTris(dimethylamido) (tert-butylimido)niobium, 한국진공학회 제65회 하계정기학술대회 & IFFM 2023(한국진공학회 (Korean Vacuum Society)), 2023-08
  • Growth Mechanism of Ge-Sb-Te Thin Films by Supercycles of ALD GeTe and Sb2Te3, ALD2023(미국진공학회 (American Vacuum Society)), 2023-07
  • Chemisorption Mechanisms of Aminosilane Precursors during ALD of SiO2: in situ characterization and ab initio study, ALD2023(미국진공학회 (American Vacuum Society)), 2023-07
  • Density Functional Theory Study on the Passivation of Oxides Surfaces by Inhibitor, ALD2023(미국진공학회 (American Vacuum Society)), 2023-07
  • The Selective Capping of Cobalt on Copper Interconnect against Inter Metal Dielectric: A Density Functional Theory Study, ASD2023(AVS(미국진공학회)), 2023-04
  • Density Functional Theory Study on Selective Etching of Silicon Oxide Against Silicon by Mixture of HF and NH4F, ASD2023(AVS(미국진공학회)), 2023-04
  • Surface Reaction during Isotropic Atomic Layer Etching of Al2O3 Using NF3 Remote Plasma and Al Precursor, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Effect of Cu Pad Dimension on Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Growth Mechanism of Ge-Sb-Te Thin Films by Supercycle of ALD GeTe and Sb2Te3, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Etching Mechanism of Amorphous Hydrogenated Silicon Nitride Using Hydrogen Fluoride, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Surface Reaction of Novel Zirconium Precursor for Atomic Layer Deposition of Zirconium Oxide: A Density Functional Theory Study, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Reaction Mechanism of Thermal Atomic Layer Deposition of Silicon Carbonitride Thin Films , 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Mechanical Reliability Improvement of Cu-Mn Interconnect for Flexible Electronics through Self-forming Process, 제30회 한국반도체학술대회(한국반도체산업협회/연구조합), 2023-02
  • Finite Element Analysis of Thermomechanical Stress in Passivation Dielectrics on Ultra Thick Metal Line, 제30회 한국반도체학술대회(한국반도체산업협회 등), 2023-02
  • Conformal Crystalline Ge-Sb-Te Thin Films for Phase Change Memory Applications, KISM2022(한국반도체디스플레이기술학회), 2022-11
  • Cu/Oxide Hybrid Bonding Analysis by Finite Element Modeling, ISMP 2022(한국마이크로일렉트로닉스 및 패키징학회), 2022-11
  • Surface Reaction Mechanism of Atomic Layer Deposition of Niobium Oxide Using Tris(diethylamido)(tert-butylimido)niobium, KISM2022(한국반도체디스플레이기술학회), 2022-11
  • Selective Etching Mechanism of Silicon Oxide Against Silicon by Hydrogen Fluoride: A Density Functional Theory Study, KISM2022(한국반도체디스플레이기술학회), 2022-11
  • Atomic Layer Deposition of Niobium Oxide Films Using (tert-Butylimido)tris(dimethylamido)niobium and Ozone, 제63회 한국진공학회 하계정기학술대회((사)한국진공학회), 2022-08
  • ALD 전구체 대량 공급을 위한 사이클론형 기화기의 전산유체역학 해석, 제63회 한국진공학회 하계정기학술대회((사)한국진공학회), 2022-08
  • Chemisorption of Tris(dimethylamino)silane on -OH Terminated SiO2 Surfaces during Atomic Layer Deposition, 제63회 한국진공학회 하계정기학술대회((사)한국진공학회), 2022-08
  • 굽힘 응력 하에서 플렉시블 전자 시스템의 안전한 설계를 위한 유한 요소 해석, 한국반도체디스플레이학회 2022년 춘계학술대회((사)한국반도체디스플레이기술학회), 2022-05
  • 사이클론형 기화기에서 전구체 액적의 전산유체역학 해석, 한국반도체디스플레이학회 2022년 춘계학술대회((사)한국반도체디스플레이기술학회), 2022-05
  • Isotropic Atomic layer etching of Al2O3 using NF3 remote plasma and Al precursors, 제29회 한국반도체학술대회(한국반도체산업협회 등), 2022-01
  • Density Functional Theory Study on the Surface Reaction of Aminosilane Precursors on an OH-terminated SiO2 surface, 제29회 한국반도체학술대회(한국반도체산업협회 등), 2022-01
  • ALD 전구체용 사이클론 형 기화기의 전산유체역학 해석, 한국반도체디스플레이학회 2021년 추계학술대회((사)한국반도체디스플레이기술학회), 2021-11
  • 고체 전구체용 Multi-Chamber Canister의 증발량 측정 및 전산유체역학 해석, 한국반도체디스플레이학회 2021년 추계학술대회((사)한국반도체디스플레이기술학회), 2021-11
  • Finite Element Analysis of Flexible Microelectronic System under Bending Stress, IUMRS-ICA 2021(IUMRS), 2021-10
  • Formation of conformal Ge2Sb2Te5 film by ALD and tellurization of Ge–Sb film for three-dimensional phase-change random-access memory applications, AVS 67 Virtual Symposium(American Vacuum Society), 2021-10
  • A comparative study on the heteroleptic Ti precursors for ALD of TiO2: DFT calculations and ALD experiments, AVS 67 Virtual Symposium(American Vacuum Society), 2021-10
  • Measurements and Prediction Model for the Evaporation of Bis(diethylamino)silane, 21st International Conference on Atomic Layer Deposition(American Vacuum Society), 2021-06
  • ALD of TiO2 using a Titanium Precursor with a Linked Amidocyclopentadienyl Ligand: A Density Functional Theory Study, 21st International Conference on Atomic Layer Deposition(American Vacuum Society), 2021-06
  • Atomic layer deposition of silicon oxide using bis(dimethyl aminomethylsilyl) trimethylsilyl amine and ozone, 21st International Conference on Atomic Layer Deposition(American Vacuum Society), 2021-06
  • Density Functional Theory Study on the Gas-phase Cleaning of SiO2 using HF and NH4F, The 8th ICMAP & The 9th ISFM(한국진공학회 등), 2021-01
  • Mechanism of Selective Cobalt Capping Process for Copper Interconnects: A DFT Study, 제28회 한국반도체학술대회(한국물리학회 등), 2021-01
  • Comparative study between cyclopentadienyl titanium trimethoxide and cyclopentadienyl titanium tris(dimethylamide) for atomic layer deposition of titanium oxide, 제28회 한국반도체학술대회(한국물리학회 등), 2021-01
  • Reaction Mechanism of Atomic Layer Deposition of SiO2 using Bis(diethylamino)silane and Ozone, 제28회 한국반도체학술대회(한국물리학회 등), 2021-01
  • 유한요소해석법을 이용한 유연전자소자의 비틀림 응력 분석, 2020년 정기학술대회 및 6G/5G 전자패키징기술 특별 심포지엄((사)한국마이크로전자 및 패키징 학회), 2020-11
  • Thermal atomic layer deposition of aluminum nitride using a liquid aluminum dihydride complex and ammonia, 20th Internatioanl Conference on Atomic Layer Deposition(American Vacuum Society), 2020-06
  • Density functional theory study on the reactions of fluorine-containing molecules on silicon nitride surface, 20th Internatioanl Conference on Atomic Layer Deposition(American Vacuum Society), 2020-06
  • Density Functional Theory Study on the Surface Reaction of the Hafnium Precursor with a Linked Amido-cyclopentadienyl Ligand, 20th Internatioanl Conference on Atomic Layer Deposition(American Vacuum Society), 2020-06
  • Density Functional Theory Study on the Reducing Agent for Atomic Layer Deposition of Tungsten Using Tungsten Chloride Precursor, 20th Internatioanl Conference on Atomic Layer Deposition(American Vacuum Society), 2020-06
  • Finite Element Analysis for Bending or Twisting of Flexible Microelectronic System, 제27회 한국반도체학술대회(한국물리학회 등), 2020-02
  • Density Functional Theory Study on the Gas-phase Etching of SiO2 using HF and NH4F, 제27회 한국반도체학술대회(한국물리학회 등), 2020-02
  • Density Functional Theory Study on the Atomic Layer Deposition of Tungsten by Using Tungsten Chloride, 제27회 한국반도체학술대회(한국물리학회 등), 2020-02
  • Comparative Study of (Me5Cp)Ti(OMe)3 and CpTi(OMe)3 as the Ti Precursors for the High-temperature Atomic Layer Deposition of TiO2, 제27회 한국반도체학술대회(한국물리학회 등), 2020-02
  • 2 단 적층 Si Die 가 본딩된 유연전자소자의 뒤틀림 해석, 한국정밀공학회 2019 추계학술대회((사)한국정밀공학회), 2019-10
  • Density functional theory study on the fluorination reactions of Si3N4 surfaces using different fluorine-containing molecules, 12th Asian-European International Canference on Plasma Surface Engineering(한국표면공학회 등), 2019-09
  • 전산유체역학에 의한 고체 전구체 승화량의 전산모사, 제57회 한국진공학회 하계정기학술대회((사)한국진공학회), 2019-08
  • Design and Optimization of Heteroleptic Zirconium Precursorsby Density Function Theory Calculation, 19th International Conference on Atomic Layer Deposition(American Vacuum Society), 2019-07
  • Si/SiGe Heterojunction 2-Terminal Thyristor Random-Access Memory for Ultra-Low-Power and High-Speed, AWAD2019(IEIE, IEICE_ES), 2019-07
  • Physical and Analytical Modeling of Si/SiGe Heterojunction Capacitor, AWAD2019(IEIE, IEICE_ES), 2019-07
  • Comparative Study between CpTi(OMe)3 and CpTi(NMe2)3 forAtomic Layer Deposition of Titanium Oxide, 19th International Conference on Atomic Layer Deposition(American Vacuum Society), 2019-07
  • Composition Control of Ge-Sb-Te Film by Supercycles of ALD GeSb andALD Sb Followed by Tellurization Annealing, 19th International Conference on Atomic Layer Deposition(American Vacuum Society), 2019-07
  • Characteristics of High-temperature ALD SiO2 Thin Films Using a SiPrecursor with Excellent Thermal Stability, 19th International Conference on Atomic Layer Deposition(American Vacuum Society), 2019-07
  • Atomic layer deposition and tellurization of Ge-Sb films for Phase-change memory applications, 제26회 한국반도체학술대회(DB하이텍, 한국반도체산업협회, 한국반도체연구조합), 2019-02
  • Screening of Reducing Agent for Atomic Layer Deposition of Tungsten Using WCl5: Density Functional Theory Study, 제26회 한국반도체학술대회(DB하이텍, 한국반도체산업협회, 한국반도체연구조합), 2019-02
  • Reaction Mechanism of ALD TiO2 using Cyclopentadienyl and Pentamethylcyclopentatidenyl Ti precursors, 제26회 한국반도체학술대회(DB하이텍, 한국반도체산업협회, 한국반도체연구조합), 2019-02
  • Design and Fabrication of Multi-Channel Nanowire SiGe MOSFET, 제26회 한국반도체학술대회(DB하이텍, 한국반도체산업협회, 한국반도체연구조합), 2019-02
  • ALD 전구체의 증발속도에 공정인자가 미치는 영향, 한국반도체디스플레이기술학회 2018 추계학술대회(한국반도체디스플레이기술학회, 연세대학교 BIT마이크로팹연구소), 2018-11
  • 불소함유 가스와 SiO2 및 Si 표면의 반응 기구, 한국반도체디스플레이기술학회 2018 추계학술대회(한국반도체디스플레이기술학회, 연세대학교 BIT마이크로팹연구소), 2018-11
  • 2단 적층 Si die가 본딩된 유연전자소자의 응력해석, 한국정밀공학회 2018 추계학술대회((사)한국정밀공학회), 2018-10
  • Reaction mechanism study on the atomic layer deposition of titanium oxide film using heteroleptic precursors, AVS 65th International Symposium&Exhibition (American Vacuum Society), 2018-10
  • Atomic Layer Deposition of Titanium Telluride and its Application as the Diffusion Barrier for Multi-level Phase Change Memory Device, IUMRS-ICEM 2018(한국재료학회, IUMRS), 2018-08
  • Atomic layer deposition of cobalt thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)cobalt, IUMRS-ICEM 2018(한국재료학회, IUMRS), 2018-08
  • Plasma-enhanced atomic layer deposition of Ruthenium thin film using (p-cymene)(dimethyl-hexadiene)ruthenium, 18th International Conference on Atomic Layer Deposition(American Vacuum Society), 2018-07
  • Atomic layer deposition of titanium oxide using heteroleptic titanium precursors with a linked ligand, 18th International Conference on Atomic Layer Deposition(American Vacuum Society), 2018-07
  • Modeling and Simulation of in-situ Cleaning Sequence Using NF3/NH3 Remote Plasma , 18th International Conference on Atomic Layer Deposition(American Vacuum Society), 2018-07
  • Modeling of dry cleaning processes of semiconductor surfaces using fluorine-based etchant gases, The 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018) (한국진공학회 등), 2018-07
  • Simulation and Measurement of Mass Evaporation Rate of Precursors inside Canister during ALD Process, 18th International Conference on Atomic Layer Deposition(American Vacuum Society), 2018-07
  • Atomic layer deposition of titanium oxideusing cyclopentadienyl-type titanium precursors, EVC-15(15th European Vacuum Conference)(IUVSTA), 2018-06
  • 실리콘 질화막의 원자층 증착 반응기구, 한국반도체디스플레이기술학회 2018 춘계학술대회(한국반도체디스플레이기술학회, 한국기계연구원), 2018-04
  • Cyclopentadienyl-type Ti precursor를 이용한TiO2 박막의 ALD 공정, 제25회 한국반도체학술대회(한국반도체산업협회, 한국물리학회 등), 2018-02
  • 열안정성이 우수한 Si Precursor를 이용한 고온 ALD SiO2 박막의 특성Characteristics of high temperature ALD SiO2 thin filmusing Si precursor with excellent thermal stability., 제25회 한국반도체학술대회(한국반도체산업협회, 한국물리학회 등), 2018-02
  • Bis(1,4-di-iso-propyl-1,4-diazabutadiene)nickel을 이용한Nickel 박막의 Plasma-enhanced Atomic Layer Deposition, 제25회 한국반도체학술대회(한국반도체산업협회, 한국물리학회 등), 2018-02
  • Design of a novel SiGe FinFET with accurate modeling of saturation velocity andhigh-frequency performances, The 10th International Conference on Advanced Materials and Devices (ICAMD),(한국물리학회), 2017-12
  • 굽힘 및 뒤틀림 혼합 변형이 인가된 유연전자소자의 응력분포해석, 한국정밀공학회 2017 추계학술대회((사)한국정밀공학회), 2017-12
  • Characteristics of Ge-Sb-Te Film Prepared by Atomic Layer Deposition and Tellurization of Ge-Sb Film, AVS 64th International Symposium&Exhibition(AVS(American Vacuum Society)), 2017-11
  • ALD of Titanium Oxide Using Cyclopentadienyl Titanium Alkylamide and Ozone, AVS 64th International Symposium&Exhibition(AVS(American Vacuum Society)), 2017-11
  • Density Functional Theory Study on the Adsorption of Ethanol onDifferent Metal Oxide Surfaces, ICAE2017(KIEEME), 2017-11
  • 박막 증착 공정용 액체 전구체의 증발속도 측정, 한국반도체디스플레이기술학회 2017년 추계학술대회((사)한국반도체디스플레이기술학회), 2017-11
  • 실리콘 염화물과 암모니아를 이용한 실리콘 질화막의 원자층 증착에서 표면반응 기구, 한국반도체디스플레이기술학회 2017년 추계학술대회((사)한국반도체디스플레이기술학회), 2017-11
  • 층간절연막용 유무기 하이브리드 스핀온 유전박막의 열처리, 한국반도체디스플레이기술학회 2017년 추계학술대회((사)한국반도체디스플레이기술학회), 2017-11
  • PEALD of Nickel Thin Film using bis(1,4-di-iso-propyl-1,4-diazabutadiene) Nickel, 17th International Conference on Atomic Layer Deposition(American Vacuum Society), 2017-07
  • Density Functional Theory Calculation on the Reaction Between Different Nitriding Agents and Chlorine-terminated Silicon Nitride Surface, 17th International Conference on Atomic Layer Deposition(American Vacuum Society), 2017-07
  • Catalyzed Atomic Layer Deposition of Silicon Oxide at Ultra-low Temperature using Alkylamines, 17th International Conference on Atomic Layer Deposition(American Vacuum Society), 2017-07
  • Chip-on-Foil 형태의 유연전자소자에서 뒤틀림 하중에 의한 응력 분포의 유한요소해석, 2017 춘계 한국마이크로전자 및 패키징학회((사)한국마이크로전자 및 패키징 학회(KMEPS)), 2017-04
  • 층간절연막용 유무기혼합 스핀온 유전박막의 특성, 2017 춘계 한국마이크로전자 및 패키징학회((사)한국마이크로전자 및 패키징 학회(KMEPS)), 2017-04
  • In-situ FTIR analysis on the catalyzed atomic layer deposition of silicon oxide at ultra-low temperatures, 제24회 한국반도체학술대회(한국반도체산업협회, 한국물리학회 등), 2017-02
  • Investigation of Mechanical Stress Distribution in Flexible Microelectionic System Under Bending Force By Finite Element Analysis, PRiME 2016 ECS(ECS), 2016-10
  • 유연기판위에 FACE-DOWN방식으로 접합된 반도체소자의 기계적 응력, 한국정밀공학회 2016년도 추계학술대회(사단법인 한국정밀공학회), 2016-10
  • Simulationof Surface Reaction during Silicon Selective Epitaxy Growth by DFT calculation, ICCGE-18(The Japan Society of Applied Physics), 2016-08
  • Reaction between silicon precursors and surface sites during atomic layer deposition of silicon nitride, IVC-20(한국진공학회), 2016-08
  • Chemical stability of lithium lanthanum titamate as a protective lithium-ion conduction layer for lithium secondary batteries, IVC-20(한국진공학회), 2016-08
  • Evaluation of barrier films against lithium diffusion for thin film lithium-ion batteries, IVC-20(한국진공학회), 2016-08
  • Plasma-enhanced atomic layer depositon of silicon nitride thin films using bis(diethylamino)silane, IVC-20(한국진공학회), 2016-08
  • PEALD of cobalt thin film using Co(dpdab), ALD2016 Ireland(American Vacuum Society), 2016-07
  • Effects of plasma reactant on low-temperature PEALD of silicon nitride using CSN-2, ALD2016 Ireland(AVS), 2016-07
  • ALD of Ge-Sb Te thin films using a chlorine-free liquid GE(ll)precursor, ALD 2016 Ireland(American Vacuum Society), 2016-07
  • 굽힘응력을 받는 유연전자소자의 기계적 응력, 한국정밀공학회 2016년도 춘계학술대회(사단법인 한국정밀공학회), 2016-05
  • Formation of Ge-Sb-Te Thin Film by Tellurization of Ge-Sb Film, 제23회 한국반도체학술대회(한국반도체산업협회,한국물리학회 등), 2016-02
  • Atomic Layer Deposition of Cobalt Thin Film for Cobalt Silicide Formation, 제23회 한국반도체학술대회(한국반도체산업협회,한국물리학회 등), 2016-02
  • Bending Test 방법에 따른 중립축 위치의 변화 The Shift of Neutral Line for Different Bending Test Modes, 한국정밀공학회 2015년도 추계학술대회(사단법인 한국정밀공학회), 2015-12
  • Investigation of Mechanical Stress in Flexible Microelectronic Under Applied Mechanical Stress by Finite Element Analysis, IUMRS-ICAM 2015(IUMRS), 2015-10
  • Atomic layer deposition of germanium antiomony alloys for Ge-Sb-Te compounds, 20th BIENNIAL EUROPEAN CONFERENCE ON CHEMICAL VAPOR DEPOSITION(EMPA), 2015-07
  • Reactivity of silicon nitride surface sites with silicon chloride precursors during atomic layer deposition, 20th BIENNIAL EUROPEAN CONFERENCE ON CHEMICAL VAPOR DEPOSITION(EMPA), 2015-07
  • In-situ FTIR analysis on the atomic layer deposition of metal owide films, 20th BIENNIAL EUROPEAN CONFERENCE ON CHEMICAL VAPOR DEPOSITION(EMPA), 2015-07
  • Atomic layer deposition of silicon nitiride thin films using octachiorotrisilane, 20th BIENNIAL EUROPEAN CONFERENCE ON CHEMICAL VAPOR DEPOSITION(EMPA), 2015-07
  • Atomic Layer Deposition and Tellurization of Ge-Sb Thin Films for Phase-Change Memory Devices, 2015 EMRS(European Materials Research Society), 2015-05
  • Atomic Layer Deposition of Cobalt Nitride film and its Application to Cobalt Silicide Formation, 2015 EMRS(European Materials Research Society), 2015-05
  • Low-temperature Plasma-enhanced Atomic Layer Deposition of Silicon Nitride Films, 2015 EMRS(European Materials Research Society), 2015-05
  • Reaction Mechanism Study on Atomic Layer Deposition of Silicon Nitride Films Using Silicon Chlorides and Ammonia, 제22회 한국반도체학술대회(한국물리학회, 한국재료학회, 대한전기학회, 대한전자공학회, 반도체설계교육센터), 2015-02
  • In Situ Studies on Reaction Mechanisms in Atomic Layer Deposition of Cobalt Oxide, 한국반도체디스플레이기술학회 2014년 추계학술대회 안내((사) 한국반도체디스플레이기술학회), 2014-12
  • ADSORPTION ENERGIES STUDY OF AMINOSILANE PRECURSORS ON SILICON NITRIDE SURFACE, ENGE2014(The Korean Institute of Metals and Materials), 2014-11
  • FORMATION OF GE-SB-TE THIN FILM BY ATOMIC LAYER DEPOSITION OF GE-SB THIN FILMS AND ITS TELLURIZATION , ENGE2014(The Korean Institute of Metals and Materials), 2014-11
  • IN-SITU FTIR STUDY ON ATOMIC LAYER DEPOSITION OF SILICON NITRIDE, ENGE2014(The Korean Institute of Metals and Materials), 2014-11
  • CHARGE TRAP MEMORY DEVICES USING ATOMIC LAYER DEPOSITIONS OF SILICON OXIDE AND SILICON NITRIDE, ENGE2014(The Korean Institute of Metals and Materials), 2014-11
  • Characteristic of Charge Trap Flash Memory with ONO Stacks Prepared by Atomic Layer Deposition, NVMTS2014(IEEE), 2014-10
  • Density Functional Theory Study of Silicon Precursors for Atomic Layer Deposition of Silicon Nitride , 16TH International Conference on Thin Films(International Conference on Thin Films), 2014-10
  • Copper Mesh as a Transparent Conductive Electrode, 제47회 한국진공학회 하계정기학술대회((사)한국진공학회), 2014-08
  • Atomic Layer Deposition of Cobalt Oxide Thin Films for Lithium-ion Battery, 제47회 한국진공학회 하계정기학술대회((사)한국진공학회), 2014-08
  • Low-Temperature Plasma-Enhanced Atomic Layer Deposition of SiliconNitride Films, ICMAP2014(The Korean Vacuum Society), 2014-07
  • Aluminum-doped Copper Oxide Thin Films prepared byAtomic Layer Deposition as Transparent p-typeSemiconductors, ICMAP2014(The Korean Vacuum Society), 2014-07
  • Atomic Layer Deposition of Silicon Nitride Thin Films Using Octachlorotrisilane and Ammonia, ALD2014(AVS, PICOSUN, ASM 등), 2014-06
  • FTIR을 이용한 ALD 증착 메커니즘 연구, 2014년 한국반도체디스플레이기술학회 춘계학술대회(한국반도체디스플레이기술학회), 2014-06
  • Atomic Layer Deposition of Cobalt Oxide FilmsUsing a Novel Cobalt Precursor and Ozone, ALD2014(AVS, PICOSUN, ASM 등), 2014-06
  • Cyclic Chemical Vapor Deposition of Ge-Sb-Te Compounds for Phase Change Memories, ALD2014(AVS ,PICOSUN, ASM 등), 2014-06
  • Density Functional Theory Study of Silicon Nitride ALD Using Silicon Chloride Precursors, ALD2014(AVS, PICOSUN, ASM 등), 2014-06
  • Density Functional Theory Study of Silicon Chlorides for Atomic LayerDeposition of Silicon Nitride Thin Films, 제46회 한국진공학회 동계정기학술대회((사)한국진공학회), 2014-02
  • Chemical Stability of Lithium Lanthanum Titanate (Li0.5La0.5TiO3) as a SolidElectrolyte for Lithium Secondary Batteries, 제46회 한국진공학회 동계정기학술대회((사)한국진공학회), 2014-02
  • Effect of Design on Thermo-Mechanical Stress in Through-Silicon Via, 제21회 한국반도체학술대회(한국반도체연구조합, 한국물리학회 등), 2014-02
  • Intercalation of CVD Graphene for Interconnects, 제21회 한국반도체학술대회(한국반도체연구조합, 한국물리학회 등), 2014-02
  • Chemical vapor deposition of molybdenum thin film for copper interconnect, 제21회 한국반도체학술대회(한국반도체연구조합, 한국물리학회 등), 2014-02
  • Evaluation of Barrier Films Against Lithium Diffusion, 제46회 한국진공학회 동계정기학술대회((사)한국진공학회), 2014-02
  • Thin film deposition of antimony tellurides for Ge–Sb–Te compounds, 제46회 한국진공학회 동계정기학술대회((사)한국진공학회), 2014-02
  • Low-Temperature Atomic Layer Deposition of Silicon Oxide Films Using Silicon Amide Precursor and Ozone, ICSE2013, 2013-11
  • Improvement of Adhesion Force of Hydroxyapatite Coating to titanium Alloy Substrate by an Yttria-stabilized Zirconia Buffer Layer, ICSE 2013, 2013-11
  • Effects of Geometry and Dielectric Liner on the Thermo-mechanical Stress Distribution in Copper Through-silicon Via Structures, EMAP2013, 2013-10
  • Hexakis(ethylamino)disilane를 이용한 3차원 플래시 메모리용 실리콘 산화막의 원자층 증착 연구, 한국반도체디스플레이기술학회 2013년 추계학술대회(한국반도체디스플레이기술학회), 2013-10
  • 화학기상증착법으로 증착된 Molybdenum 박막의 특성, 한국반도체디스플레이기술학회 2013년 추계학술대회(한국반도체디스플레이기술학회), 2013-10
  • 유한요소 해석법을 이용한 실리콘관통 전극의 열응력 해석, 한국정밀공학회 2013년도 추계학술대회(한국정밀공학회), 2013-10
  • Atomic Layer Deposition of Metal Phosphate Thin Films, 13th International Conference on Atomic Layer Deposition(ALD2013), 2013-07
  • Atomic layer deposition of silicon nitride films using silicon chlorides and ammonia, 13th International Conference on Atomic Layer Deposition(ALD 2013), 2013-07
  • Diffusion barrier properties of molybdenum nitride thin film prepared by atomic layer deposition, 13th International Conference on Atomic Layer Deposition(ALD2013), 2013-07
  • Atomic Layer Deposition of Oxide Thin Films for Lithium Ion Batteries, E-MRS 2013 spring meeting(E-MRS 2013), 2013-05
  • ALD Copper Nitride 박막의 열처리에 의한 Cu 도금용 Cu seed layer 형성, 한국반도체디스플레이기술학회 2013년 춘계학술대회(한국반도체디스플레이기술학회), 2013-05
  • QCM을 이용한 ALD 공정의 모니터링 및 제어 시스템, 한국반도체디스플레이기술학회 2013년 춘계학술대회(한국반도체디스플레이기술학회), 2013-05
  • Bis(tertiary-butylamino)silane를 이용한 3차원 플래시 메모리용 실리콘 산화막의 원자층 증착 연구, 한국반도체디스플레이기술학회 2013년 춘계학술대회(한국반도체디스플레이기술학회), 2013-05
  • Characteristics of Charge Trap Flash Memory Devices Fabricated by Atomic Layer Deposition of Silicon Oxide and Nitride, 제20회 한국반도체학술대회(한국반도체산업협회), 2013-02
  • Cu TSV에서 Dielectric Liner의 종류 및 형상에 따른 열응력 분포의 해석, 2012 추계 한국마이크로전자 및 패키징 학회((사)한국마이크로전자 및 패키징학회), 2012-11
  • Ag 박막의 합금화에 의한 내환경 특성 향상에 관한 연구, 2012 추계 한국마이크로전자 및 패키징학회((사)한국마이크로전자 및 패키징학회), 2012-11
  • Cycle life Characterization of Lithium-ion Batteries with Artificial Solid-electrolyte Interphase Coating on Both Electrodes, 222nd ECS Meeting-2012 Fall Meeting(ECS 2012), 2012-10
  • Failure Mechanism of Copper Through-Silicon Vias under Bias-Temperature Stress, 222nd ECS Meeting-2012 Fall Meeting(ECS 2012), 2012-10
  • Atomic layer Deposition of Thin Film for Lithium Ion Batteries, 2nd ENGE 2012(대한금속.재료학회), 2012-09
  • Characteristics of Charge Trap Flash Memory DevicesFabricated by Atomic Layer Deposition, IUMRS-ICA 2012(한국재료학회), 2012-08
  • Properties of copper-based oxide thin films prepared by atomic layer deposition as transparent p-type semiconductors, IUMRS-ICA 2012(한국재료학회), 2012-08
  • Accelerated Lifetime Measurement of Copper Through-Silicon Vias (TSVs) Under Biased-Thermal Stress , IUMRS-ICA 2012(한국재료학회), 2012-08
  • Low-Temperature ALD of Cobalt Oxide Thin Films Using Cyclopentadienylcobalt Dicarbonyl and Ozone, 12th International Conference on Atomic Layer Deposition(ALD 2012), 2012-06
  • Formation of Copper Seed Layer by Reduction of ALD Copper Nitride FilmPrepared Using Bis(1-dimethylamino-2-methyl-2-butoxy)copper, 12th International Conference on Atomic Layer Deposition(ALD 2012), 2012-06
  • ALD Cu3N 박막의 환원 열처리에 의한 반도체 Cu 배선용 Cu seed layer 형성, 2012년 대한금속.재료학회 춘계학술대회 ((사)대한금속.재료학회), 2012-04
  • 리튬 이차전지의 수명 및 안정성 향상을 위한 ITO 및 ZnO 인공 고체 전해질 계면, 2012년 한국금속.재료학회 춘계학술대회((사)한국금속.재료학회), 2012-04
  • Diffusion Barrier Against Copper Ion Drift Under Biased Thermal Stress: A Comparison Between Through-silicon Via and Planar Structures, 제19회 한국반도체학술대회(한국재료학회), 2012-02
  • Low-temperature Atomic Layer Deposition of Cobalt Oxide Thin FilmsUsing Cyclopentadienylcobalt Dicarbonyl and Ozone, 제19회 한국반도체학술대회(한국재료학회), 2012-02
  • Cuⅱ(dmamb)2 전구체를 이용한 전해도금용 구리 씨앗층의 원자층 증착에 관한 연구, 2011년도 한국재료학회 추계학술발표대회 및 제21회 신소재 심포지움, 2011-10
  • 가속수명시험을 이용한 TSV 확산방지막 Ti의 수명예측, 한국정밀공학회 2011년도 추계학술대회 논문집(사단법인 한국정밀공학회)(사단법인 한국정밀공학회), 2011-10
  • Quartz Crystal Microbalance (QCM, GaPO4 sensor)을 활용한 Tris-PYS(TPS) Precursor의 Silicon Oxide 원자층 증착 메카니즘 분석에 관한 연구, 2011년도 한국재료학회 추계학술대회 및 제12회 신소재 심포지움(한국재료학회)(한국재료학회), 2011-10
  • Cyclopentadienycoblat Dicarbonyl을 이용한 Coblat Oxide 박막의 저온 원자층 증착 공정, 2011년도 한국재료학회 추계학술발표대회 및 제 21회 신소재 심포지움, 2011-10
  • Atomic Layer Deposition of Copper Seed Layer for Electroplating Using Cu(dmamb)2 and H2, Advanced Metallization Conference2011(sematech)(sematech), 2011-10
  • Adhesive Bonding of Graphene to Transparent Substrate, Nano Korea 2011(나노코리아조직위원회)(나노코리아조직위원회), 2011-08
  • Atomic layer Deposition of Cobalt Oxide Films, 219th ECS Meeting, 2011-05
  • Atomic Layer Deposition and Characterization of SiO2 Films from Noble Amino Silane and Ozone, 219th ECS Meeting, 2011-05
  • Li2Co3 분말을 이용한 고밀도 Li1+xCoO2 Target 제조, 제40회 한국진공학회 동계 정기 학술대회(사단법인 한국진공학회)(사단법인 한국진공학회), 2011-02
  • Atomic Layer Deposition of Silicon Oxide Thin Films Using Noble Amino Silane and Ozone, 제18회 한국반도체학술대회(한국반도체산업협회)(한국반도체산업협회), 2011-02
  • Biased Thermal Stress 인가에 의한 TSV용 Cu 확산방지막 Ti를 통한 Cu drift 측정, 제40회 한국진공학회 동계 정기 학술대회(사단법인 한국진공학회)(사단법인 한국진공학회), 2011-02
  • Dicobalt hexacarbonyl tert-butylacetylene와 ozone을 이용한 cobalt oxide의 원자층 증착 공정, 제40회 한국진공학회 동계 정기 학술대회(사단법인 한국진공학회)(사단법인 한국진공학회), 2011-02
  • Synthesis of Multilayer Graphene for a New Interconnection Material Using Fe Foil, 제18회 한국반도체 학술대회(한국반도체산업협회)(한국반도체산업협회), 2011-02
  • ALD Copper Film as a Seed Layer for Electroplating of copper, 제18회 한국반도체학술대회(한국반도체산업협회)(한국반도체산업협회), 2011-02
  • Characteristics of Cobalt Oxide Films Grown by Atomic Layer Deposition, International Conference on Electronic Materials and Nanotechnology for Green Environment2010, 2010-11
  • Microstructure and Electrical Conductivity of Yttriastabilized Zorconia Thin Film Prepared by Pulsed Laser Deposition, International Conference on Electronic Material s and Nanotechnology for Green Environment2010, 2010-11
  • Influences of Deposition Temperature on the Properties of Al2O3 Thin Films Grown by Atomic Layer Deposition from Al(CH3)3 and O3, International Conference on Electronic Materials and Nanotechnology for Green Environment2010, 2010-11
  • Characteristics of SiO2 and SiN Thin Films Grown by Atomic Layer Deposition Using Teterakis(ethylamino)silane Precursor, International Conference on Electronic Materials and Nanotechnology for Green Environment2010, 2010-11
  • Time-Dependent Dielectric Breakdown of The Silicon Oxide Liner in The Copper Through-Silicon Via Structure, 12th International Conference on Electronics Materials and Packaging(EMAP2010)(EMAP2010), 2010-10
  • Influence of the Deposition Temperature on the Properties of Copper Thin Film Prepared by Alternating Injection of Cu(ethylketoiminate)2 and H2 on a Ruthenium Substrate, IUMRS-ICEM2010(International Union of Material Research Societies)(International Union of Material Research Societies), 2010-08
  • The Electical Properties of SiO2/AI2O3/Sio2 Dielectric Stacks Prepared by Atomic Layer Deposition Method, IEEE NANO 2010 (NANO KOREA 2010)(NANO KOREA 2010), 2010-08
  • Influence of Oxidant on the Defect Energy Level of Al2O3 Thin Films Prepared by Atomic Layer Deposition, IUMRS-ICEM2010(International Union of Materials Research Societies)(International Union of Materials Research Societies), 2010-08
  • Characteristics of SiO2 Films Grown by Atomic Layer Deposition Method Using Tetrakis(ethylamino)silane and Ozone, 10th International Conference on Atomic Layer Deposition(ALD2010)(ALD2010), 2010-06
  • TSV에서의 절연막에 따른 누설전류의 측정, 2010년도 춘계학술대회 논문집(한국정밀공학회)(한국정밀공학회), 2010-05
  • 구리 전해도금용 시앗층의 원자층 증착 공정, 2010년도 대한금속.재료학회 춘계학술대회(대한금속.재료학회)(대한금속.재료학회), 2010-04
  • 티타늄 임플란트와 수산화아파타이트 사이의 접착력 향상을 위한 Yttria-stabilized Zirconia Buffer Layer에 관한 연구, 38회 한국진공학회 동계정기학술대회(한국진공학회)(한국진공학회), 2010-02
  • 펄스 레이저 증착법(PLD)으로 제조된 LiCoO2 박막의 특성, 제38회 한국진공학회 동계정기학술대회(한국진공학회)(한국진공학회), 2010-02
  • 전해도금을 위한 ALD Cu seed와 PVD Cu seed의 특성 비교, 제38회 한국진공학회 동계정기학술대회(한국진공학회)(한국진공학회), 2010-02
  • Atomic Layer Deposition에 의해 제조된 Cobalt Oxide 박막의 특성, 제38회 한국진공학회 동계정기학술대회(한국진공학회)(한국진공학회), 2010-02
  • Cu확산을 측정하기 위한 TSV구조의 설계(A design of TSV structures for measurement of Cu diffusion), 한국마이크로전자 및 패키징 학회 2009년도 추계 학술대회 초록집(한국마이크로전자 및 패키징 학회)(한국마이크로전자 및 패키징 학회), 2009-11
  • 자기형성피막에 의한 Cu 박막과 glass 기판과의 접착력 향상, 2009년도 대한금속.재료학회 추계 학습대회 초록집(대한금속.재료학회)(대한금속.재료학회), 2009-10
  • The Effect of Mg Contents and Annealing Temperature on the Adhesion of Cu(Mg) Film to Glass Substrate, Seventh Asian-European International Conference on Plasma Engineering (AEPSE2009)(AEPSE2009), 2009-09
  • Characterization of double interfaces system (Si3N4/SiO2/Si and SiO2/Si3N4/Si) grown by ALD, Proceedings of 31st international symposium on dry process(DPS2009)(DPS2009), 2009-09
  • The Electrical Properties of SiO2/AI2O3/SiO2 Stacks Grown by Atomic Layer Deposition for Flash Memory Applications, The 2nd International Conference on Microelectronics And Plasma Technology(ICMAP2009)(ICMAP2009), 2009-09
  • Influences of Deposition Temperature on the Properties of Al2O3 Thin Films Grown by Atomic Layer Deposition from Al(CH3)3 and O3, The 2nd International Conference on Microelectronics And Plasma Technology(ICMAP2009)(ICMAP2009), 2009-09
  • Atomic Layer Deposition of SiO2 Film using Hexakis(ethylamino)disilane, 9th International Conference on Atomic Layer Deposition(ALD2009)(ALD2009), 2009-07
  • Influences of Reducing Agent on the Atomic Layer Deposition of Copper Thin Film using Cu(EtNO-ketoiminate)2, 9th International Conference on Atomic Layer Deposition(ALD2009)(ALD2009), 2009-07
  • Atomic Layer Deposition of Copper Thin Film using CuII(diketoiminate)2 and H2, Proceedings of the 12th Annual 2009(IITC-International Interconnect Technology Conference)(IITC-International Interconnect Technology Conference), 2009-06
  • Influences of Mg Content and Annealing on the Adhesion of Cu(Mg) Thin Film to Glass Substrate, 제16회 한국반도체학술대회(한국물리학회 반도체분과회)(한국물리학회 반도체분과회), 2009-02
  • Atomic Layer Deposition of Hafnium Dioxide Using Cyclopentadienyl Hf Precusor, 제16회 한국반도체학술대회(한국물리학회 반도체분과회)(한국물리학회 반도체분과회), 2009-02
  • Atomic Layer Deposition of Copper Thin Film using CuII (diketoiminate)2 and H2, 제16회 한국반도체학술대회(한국물리학회 반도체분과회)(한국물리학회 반도체분과회), 2009-02
  • Liquid Crystal on Silicon(LCOS)패널을 위한 Index-matched ITO(IMITO)유리의 개발, 제36회 한국진공학회 동계 정기학술대회 초록집(한국진공학회)(한국진공학회), 2009-02
  • Cell Gap조절에 의한 Liquid Crystal on Silicon(LCOS) 패널 특성의 향상, 제36회 한국진공학회 동계 정기학술대회 초록집(한국진공학회)(한국진공학회), 2009-02
  • E-beam evaporation에 의한 수직배향 액정용 무기배향막 증착, 제36회 한국진공학회 동계 정기학술대회 초록집(한국진공학회)(한국진공학회), 2009-02
  • Influences of Mg Content and Annealing on the Adhesion of Cu(Mg) Thin Film to Glass Substrate, Advanced Metallization Conference 2008: Asian Session(The Japan Society of Applied Physics)(The Japan Society of Applied Physics), 2008-10
  • Silicon Nitride Thin Films Prepared by Atomic Layer Deposition Using Si2Cl6 and NH3 as the Precursors, The 1st Int. Conf. on Microelectronics and Plasma Technology(The Korean Vacuum Society)(The Korean Vacuum Society), 2008-08
  • Cu 배선 공정의 Electroplating 공정을 위한 Cu 씨앗층의 원자층 증착 방법, 한국진공학회 제 35회 하계 정기학술대회(한국진공학회)(한국진공학회), 2008-08
  • Atomic Layer Deposition of Dielectric Stacks Containing Hafnium-Based Dielectrics for Flash Memory Applications, 8th International Conference on Atomic Layer Deposition(American Vacuum Society)(American Vacuum Society), 2008-06
  • ALD of Cu Seed Layer for Electroplating of Cu Interconnect, 8th International Conference on Atomic Layer Deposition(American Vacuum Society)(American Vacuum Society), 2008-06
  • Electrical Properties of SiO2/Al2O3/SiO2 Stacks Grown by Atomic Layer Deposition Method, 제15회 한국반도체학술대회 발표논문집(한국물리학회)(한국물리학회), 2008-02
  • Pulsed Inductively-Coupled Plasma를 이용한 Phosphorus의 도핑 및 Shallow Junction의 형성, 제15회 한국반도체학술대회 발표논문집(한국물리학회)(한국물리학회), 2008-02
  • Influence of Sterilization Method on the Microstructure of Hydroxyapatite Coating Prepared by Using Pulsed Laser Deposition Method, 1st Asian Biomaterials Congress (The Ceramic Society of Japan, Japanese Society for Biomaterials(The Ceramic Society of Japan, Japanese Society for Biomaterials), 2007-12
  • Adhesion of Hydroxyapatite Coating onto Ti-6Al-4V Substrate by a Two-step Pulsed Laser Deposition Process, 1st Asian Biomaterials Congress(The Ceramics Society of Japan, Japanese Society for Biomaterial(The Ceramics Society of Japan, Japanese Society for Biomaterial), 2007-12
  • Comparison of BF2+ with B+ Low Energy Ion Implantation into Si (100), 6th Asian-European Int. Conf. on Plasma Surface Eng.(Japanese Society of Applied Physics 등)(Japanese Society of Applied Physics 등), 2007-09
  • The Study of Plasma Doping Process for Ultra Shallow Junctions, The 7th International Workshop on Junction Technology (IEEE 등)(IEEE 등), 2007-06
  • Atomic Layer Deposition of Oxide/Nitride/Oxide Stacks for Flash Memory Applications, 7th International Conference on Atomic Layer Deposition (American Vacuum Society)(American Vacuum Society), 2007-06
  • Ultra shallow junction을 위한 플라즈마 이온주입 공정 연구, 한국전기전자재료학회 2007년도 하계학술대회 (한국전기전자재료학회)(한국전기전자재료학회), 2007-06
  • Electrical Properties of Dielectric Stacks Consisting of Silicon Oxide and Aluminum Oxide for Interpoly Dielectrics of Flash Memory Device, 7th International Conference on Atomic Layer Deposition (American Vacuum Society)(American Vacuum Society), 2007-06
  • Shallow Junction을 위한 Plasma Source Ion Implantation(PSII) 공정 연구, 한국진공학회 제 32회 학술발표회 (한국진공학회)(한국진공학회), 2007-02
  • Electrical Properties of Al2O3 Thin Films Prepared by Atomic Layer Deposition Using Various Oxidants, 제14회 한국반도체학술대회 발표논문집 (한국물리학회)(한국물리학회), 2007-02
  • Characteristics of Calcium Phosphate Coatings Prepared by Pulsed Laser Deposition Method at Various Substrate Temperatures, Bioceramics 19, 2006-10
  • Influence of Ambient Gases on the Properties of Hydroxyapatite Films Prepared by Pulsed Laser Deposition, IUMRS International Conference in Asia 2006 (IUMRS-ICA-2006)(IUMRS-ICA-2006), 2006-09
  • Atomic Layer Deposition of Silicon Oxide Film as a Gate Insulator for Low-Temperature Polysilicon Thin-Film Transistor, IUMRS International Conference in Asia 2006 (IUMRS-ICA-2006)(IUMRS-ICA-2006), 2006-09
  • Sinterbility and Mechanical Properties of Zirconia Nanoparticles Prepared by Hydrothermal Process, IUMRS International Conference in Asia 2006 (IUMRS-ICA-2006)(IUMRS-ICA-2006), 2006-09
  • Immersion Behavior of Hydroxyapatite Coatings Prepared by Pulsed Laser Deposition, 7th Asian Symposium on Biomedical Materials (ASBM-7)(ASBM-7), 2006-08
  • Effects of Thin Hydroxyapatite Coating on Initial Response of Osteoblast-Like Cells, 7th Asian Symposium on Biomedical Materials (ASBM-7)(ASBM-7), 2006-08
  • Characteristics of Low-Temperature Polysilicon Thin-Film Transistor with Gate Insulator Grown by Atomic Layer Deposition, 2006 MRS Spring Meeting, 2006-04
  • Adhesion of Pulsed Laser Deposited Calcium Phosphate Films to Titanium Alloy and Zirconia Substrates, 2006 MRS Spring Meeting, 2006-04
  • Characteristics of PECVD Si Films with Si Seed Layer Grown by Atomic Layer Deposition, 제13회 한국반도체학술대회 발표논문집 (한국물리학회)(한국물리학회), 2006-02
  • Characteristics of SiO2 Films Grown by Atomic Layer Deposition as the Gate Insulator of Low-Temperature Polysilicon Thin-Film Transistors, 제13회 한국반도체학술대회 발표논문집 (한국물리학회)(한국물리학회), 2006-02
  • 펄스 레이저 증착법으로 제조된 수산화아파타이트 박막의 특성 및 기판과의 접착력에 공정 기체가 미치는 효과, 제30회 학술발표회(한국진공학회)(한국진공학회), 2006-02
  • Histomorphometric Analysis of Zirconia/Alumina Composite and CP Titanium Treaded Implants in Rabbit Tibia, Annual Meeting of the International Society for Ceramics in Medicine, 2005-12
  • 펄스화 레이저 증착법에 의해 제조된 수산화아파타이트 코팅과 티타늄 합금 기판 및 지르코니아 기판과의 접착력 비교, 한국생체재료학회 제 14차 학술대회 발표논문집 (한국생체재료학회)(한국생체재료학회), 2005-09
  • Pulsed Laser Deposition 법으로 제조된 인산칼슘 박막 특성의 증착온도 영향, 한국생체재료학회 제14차 학술대회 발표논문집 (한국생체재료학회)(한국생체재료학회), 2005-09
  • 원자층 증착법으로 형성된 실리콘 산화막의 특성, 한국진공학회 제 29회 학술발표회 (한국진공학회)(한국진공학회), 2005-08
  • 펄스화 레이저 증착방법에 의해 제조된 인산칼슘 박막의 티타늄 합금 및 지르코니아 기판과의 결합력 비교, 한국진공학회 제 29회 학술발표회 (한국진공학회)(한국진공학회), 2005-08
  • Pulsed Laser Deposition 법으로 제조된 인산칼슘 박막의 레이저 밀도와 증착 온도 의존성, 한국진공학회 제 29회 학술발표회 (한국진공학회)(한국진공학회), 2005-08
  • Characteristics of silicon oxide and silicon nitride thin films grown by atomic layer deposition, The 1st Korean ALD Workshop 2005 Proceedings (한국 ALD 연구회)(한국 ALD 연구회), 2005-06
  • Hydroxyapatite Coatings Deposited by KrF-Laser Ablation and its Adhesion to Metallic and Ceramic Implants., 2005 MRS Spring Meeting (Materials Research Society)(Materials Research Society), 2005-04
  • Low-Temperature Deposition of Silicon Oxide Thin Films using Alternating Exposures of SiH2Cl2 and O3/O2, 2005 MRS Spring Meeting (Materials Research Society)(Materials Research Society), 2005-04
  • Pulsed Laser Deposition 방법으로 제조된 Hydroxyapatite 박막 특성에 영향을 주는 공정 변수 효과, 2005 춘계 한국세라믹학회 연구발표회 (한국세라믹학회)(한국세라믹학회), 2005-04
  • Characteristics of SiO2 films grown by atomic layer deposition from SiH2Cl2 and O3/O2, 제12회 한국반도체학술대회 (한국물리학회)(한국물리학회), 2005-02
  • Characteristics of Silicon Nitride Thin Films Prepared Using Alternating Exposures of SiH2Cl2 and NH3, 제12회 한국반도체학술대회 (한국물리학회)(한국물리학회), 2005-02